Within a third-party funded research project the TU Berlin will investigate the influence of the quality of copper micro-vias in printed circuit boards on the imitation and development of damage under thermomechanical alternating stress.
The work at TU Berlin focusses on the development on reliability testing and analysis of specially prepared samples and theoretical support through finite element simulation.

• Successfully completed university degree (Master, Diplom or equivalent) in Electrical Engineering, Physics, Mechanical Engineering, Materials Science, Physical Engineering, or comparable
• Knowledge and experience in at least two of the following areas
  a) Finite element simulation
  b) Materials for assembly and joining technology
  c) Knowledge of electrical measurement technology and signal processing
• Good German and/or English skills required; willingness to acquire any missing language skills
• Knowledge of testing technology (e.g., supervision of measurement test setups, fault analysis in electronic components) desirable
• Structured and independent way of working desirable
• Willingness to take responsibility for subtasks desirable
• Ability to work in a team, willingness to document desirable

Please send your application with the reference number and the usual documents (one file max. 5 MB) only via email to personal@tmp.tu-berlin.de.

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To ensure equal opportunities between women and men, applications by women with the required qualifications are explicitly desired. Qualified individuals with disabilities will be favored. The TU Berlin values the diversity of its members and is committed to the goals of equal opportunities. Applications from people of all nationalities and with a migration background are very welcome.